Description:

The EVG?610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.

Stand-alone system for wafer sizes up to 100 mm / 150 mm / 200 mm 

Top-side / bottom-side alignment down to ? 0.5 ?m / ? 1.0 ?m 

High-resolution top- and bottom-side splitfield microscopes for double-side alignment 

Soft-, hard-, vacuum contact and proximity exposure 

Automated wedge compensation 

Bond Alignment and NIL option 

Supports the latest UV-LED technology