Description:

Wafer bonding system for R&D or low-volume production – fully compatible with high-volume-manufacturing equipment

The EVG510 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm. This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes with a conversion time of less than 5 minutes. This versatility is ideal for universities, R&D facilities, or low-volume production applications. The design of the bond chambers is the same on the EVG high-volume-manufacturing tools, such as the EVG GEMINI, and the bonding recipes are easily transferable, allowing for easy scale up of production volumes.

All of the features of the EVG?501 

Single chamber system for up to 150 mm and 200 mm wafers 

Lowest cost-of-ownership for R&D and pilot-line production 

Unmatched pressure and temperature uniformity 

High yield through automatic wedge compensation 

Recipe compatible to EVG HVM bonding systems 

High throughput with fast heating and pumping specifications