Wire bonders and die bonders- Bond testers
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EVG301 Single wafer cleaning system
Description:
R&D type single wafer cleaning system
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG’s wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.