Description:

Production system for wafer sizes up to 150 mm / 200 mm 

Proximity wedge error compensation 

Handling of multiple wafer sizes with quick changeover time of less than 5 min. 

Up to 180 wph first print mode / 140 wph automatic alignment mode 

Optional stand-alone version with anti-vibration granite table 

Dynamic alignment function featuring real-time offset correction 

Supports the latest UV-LED technology

The EVG?620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.

The EVG?6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.