Description:

The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose process ovens. Outstanding process stability and repeatability. The SRO is ideal for R&D as well for low to high volume production. From the table top model SRO 700 to the SRO i-Line.

SRO-700 – a table top IR vacuum reflow oven is the essential entry level reflow soldering oven capable of fulfilling all your basic process requirements.
This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.
With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. The SRO-700 is an incredibly versatile reflow oven for semiconductor and MEMS application.

SRO-716 Due to its high clearance above the heated surface the system allows for easy handling of IGBT and power electronics packages while the large heated area (314x314mm) offers excellent flexibility. As a result the SRO-716 can be utilized in every conceivable semiconductor and MEMS application ? whether using flux, fluxless or solder paste for your reflow process. 

SRO-i-Line is a high volume production tool used for vacuum reflow soldering. ?
This system can easily be upgraded from the basic one process chamber version to three process chambers all within the same footprint. Each chamber is individually programmable to perform its own process. This allows for the most flexible solution within your production. ?
The SRO-i-Line comes standard with formic acid bubblers and auto refill assembly. This in combination with the standard equipped vacuum pump guarantees the best reflow soldering results compared to any other standard equipment in the market. Formic acid together with vacuum results in significant void reduction over the full reflow soldering area as well as the entire product load.?
With the new generation of flux based solder pastes requiring a very low oxygen content to be present during the process run, the SRO-i-Line has embedded this capability as a standard application to achieve a process environment in the sub-ppm range with minimal nitrogen consumption. Thanks to its flexible design the SRO-i-Line can be tailored to your specific requirements ? Manual Loading (ML), Cassette to Cassette (CTC) or directly placed into your automated production line (CB).