Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Encapsulation devices
- Dicing saws
- Materials
Die bonder T-4909-AE
Producer:
Dr Tresky
Application:
Electromobility
Microassembly
Semiconductor electronics
Thick film hybrids and LTCC
Category:
Wire bonders and die bonders
Description:
T-4909-AE
Budget sensitive Manual Die Bonder
The T-4909-AE is Tresky’s 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
• Manual Z-Axis with digital bond force display
• Integrated Dispenser
Excellent performance, ergonomically designed and high reliability makes the T-4909-AE ideal for small and medium volume production.
Application:
Die Attach, Flip-Chip, MEMS, MOEMS, VCSEL, RFID, Adhesive Bonding, Eutectic Bonding.