EVGroup and Raith at the Semicon trade fair in Munich10-13.11.2026
EVGroup and Raith will soon be exhibiting at the Semicon trade fair in Munich. We invite you to visit the booths! EV Group (EVG) provides…
Category: News
F&S Bondtec Semiconductor Austrian producer of wire bonders and testers at Evertiq Expo 2026 in Warsaw
Thank you for visiting our stand at Evertiq Expo. It was a pleasure to meet you and discuss topics related to wire bonding that are…
The new Pioneer: better performance, greater usability. The same unique EBL- SEM hybrid.
It is an ideal, multi-purpose tool for academic research communities working in photonics, materials science, and quantum technologies. The RAITH PIONEER, their multifunctional electron beam…
Wire Bonding Training
The German company Bond-IQ , which collaborates with Austrian company F&S Bondtec Semiconductor producer of wire bonders and testers, regularly organizes wire bonding training courses…
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The EVG®880 LayerRelease™ system from Austrian company EVGroup is a fully automated, next-generation platform for the transfer of thin semiconductor layers in high-volume production (HVM)….
T-200 Bonding Plattform for Research, Development, and Prototyping from German company Tresky
The Tresky T-200 is a precision die bonding platform designed for photonics, MEMS, semiconductor and sensor packaging applications. Its flexibility and accuracy make it ideal…
New Bondtec Bonder Series: 90i
Maximum flexibility with a working area of 480 x 700 mm for a wide range of applications; Upgradeable to a fully automatic bond tester; Interchangeable…
Unlock the full nano patterning potential of your SEM or FIB-SEM
Meet the new ELPHY, an improved version of the world’s most successful pattern generator of Raith that upgrades any SEM or FIB-SEM with dedicated nanolithography…
Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG®150-class performance in a smaller-scale, highly flexible format EV Group (EVG), a…
Loadpoint – Dicing Solutions and services
Loadpoint, the home of advanced dicing solutions and services. They are pioneers in providing innovative dicing solutions that meet the most demanding requirements of the…
The new Raith E-LINE system
Meet the new E-LINE 100, well-established and unique multifunctional nanoengineering EBL Raith system now with more functionalities and better performance! Key Features: •True multifunctionality…
Active Alignment for Photonics, Optoelectronics and Advanced Packaging
For demanding photonic and optoelectronic applications, Tresky provides high precision active alignment systems that ensure optimal optical performance and repeatability. Active alignment of optical…
F&S BONDTEC wins 2nd Place at the Productronica Innovation Award 2025!
We are proud to announce that F&S BONDTEC has been awarded 2nd Place at the prestigious Productronica Innovation Award 2025 – right in the year…
NEW HRX-02 Digital Video Microscope 3D
The latest innovation in 3D Digital Microscopy. The HRX-02 is the result of over 40 years of optical manufacturing from Hirox. Zoom from 0.1x…
ATHOS – the ultimate laser lithography system especially designed for holographic applications
Raith company launched ATHOS, new laser lithography product series engineered specifically for holographic origination and optical security. ATHOS is the ultimate laser lithography…
EVG Technologies
For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical…
F&S Bondtec Semiconductor supports AGH Racing!
The Bondtec team, a leading manufacturer of wire bonders and specialist in battery bonding, repaired AGH Racing high-voltage battery packs, and thanks to this, the…
Microelectronics for military lead: Tresky presents robust DIE bonding and fiber optic technologies for modern defense systems
With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing….
“Automatic Remanufacturing Wire Bonded Battery Modules: 80% of cells can start a second life.”
F&S Bondtec Semiconductor at The Battery Show Europe 2025 in Stuttgart, June 3-5, 2025 F&S BONDTEC, leading producer of wire bonders and pull/shear testers,…
VECTOR – Raith’s new solution that takes SEM measurements to the next level
RAITH is excited to present the first all in one configurable SEM system for metrology, defect inspection and SEM review with a focus on gauge…
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This…
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System
Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces EV Group (EVG), a leading provider of…
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of…
New, revolutionary IONMASTER (FIB SIMS tool) from Raith provides incredible capabilities in elemental analysis.
IONMASTER is a powerful ion microscope for 3D imaging and SIMS nanoanalytics. This groundbreaking instrument is designed to redefine the boundaries of advanced material characterization….
EVGroup at Semicon Europa in Munich
EVGroup (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, invites you to their booth at…
HIROX microscope once again at Evertiq Expo in Warsaw
Thank you for visiting the HIROX table at Evertiq Expo in Warsaw! Do you want to take advantage of state-of-the-art visual inspection, 2D, 3D…
EVGroup at Laser Workshop in Sopot and InterNanoPoland in Katowice
Harald Wiesbauer and Anna Duduś from EVGroup will be taking part in the Workshop on the Physics and Technology of Semiconductor Lasers in Sopot and…
Bondtec at InterNanoPoland in Katowice
Stefan Berger from F&S Bondtec Semiconductor will be together with the 53xxBDA wire bonder at the InterNanoPoland conference in Katowice on October 16-17, 2024….
F&S Bondtec Semiconductor celebrates 30th Anniversary!
It’s been 30 incredible years of innovation, growth and success at F&S Bondtec. From humble beginnings to becoming a global leader in the semiconductor industry,…
New Tresky T-5500 High Force Die Bonder & Component Placer
NEW, 1000N High Force Die Bonder with intigrated compensations frame. Programmable Z-axis and new motorized Theta-axis (spindle rotation). Tresky’s T-5500 adds a High Force…
New dimensions – new corporate identity of Raith
As the world around us is constantly evolving, so is Raith as a company. Much has happened over the past years, and they want their…
Manual mode for maximum control and flexibility with Tresky DIE bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users and makes it…
F&S BONDTEC will participate in PCIM Europe for the first time!
PCIM Europe is a leading trade fair for power electronics, intelligent motion, renewable energy and energy management. We warmly invite you to visit Bondtec booth…
Dr Tresky, F&S Bondtec Semiconductor, Tresky Automation GmbH at PCIM Europe 2024 in Nuremberg on days 11-13.06.2024.
PCIM Europe and SMTconnect trade fair in Nuremberg start tomorrow! We invite you to visit the stands: Dr Tresky AG https://www.tresky.com/ 5.326 Die…
EV Group (EVG) Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024 in Denver.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that new developments in heterogeneous…
The transition from wedge-wedge wire bonding to ball bonding: A technical overview.
While wedge-wedge bonding is effective, it has its limitations in applications with finer pitches and certain materials. Moving to ball bonding offers more flexibility and…
NEW COOPERATIVE PROJECT MUSIC: COMPETITIVE SOLUTIONS FOR MICROACOUSTIC DEVICES
In the cooperative project MUSIC, Silicon Austria Labs (SAL) and four industrial partners STMicroelectronics, USound, EV Group i Evatec are developing new competitive solutions for…
Tresky Automation new white paper regarding pressure-assisted metallic sintering in power electronics is now available for download on their webpage.
This technical paper explores the compelling motivations behind the alternative of pressure-assisted metallic sintering in the realm of power electronics. As the demand for more…
Dicing Services
The English company Loadpoint is not only a manufacturer of precise dicing saws, but also offers cutting services. New clean room, featuring 3 state of…
Mastering Nanostructures – LBL (Laser Beam Lithographjy) webinar available on demand
The newest addition to Raith’s portfolio, the PICOMASTER series adds laser lithography capabilities to their already impressive range of solutions. In a fascinating webinar hosted…
Discover the World of Pull Testing of Wire Bonds!
Pull testing is a vital quality control technique in wire bonding. What is Pull Testing in Wire Bonding? Pull testing is a testing method that…
EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity
At the end of November EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, completed…
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award for ‘Best Innovation in Holographic Technology’! Each year since 1994, the International Hologram Manufacturers Association…
A good opportunity to meet companies at the Productronica and Semicon and discuss your needs and expectations.
The Productronica and Semicon fairs in Munich have started today. We invite you to visit the booths of the following companies: ATV Technologies Hall…
Hirox microscope at Evertiq Expo in Warsaw
Thank you for visiting our stand at Evertiq Expo. It was a pleasure to meet you and demonstrate the HIROX microscope and its unique features!…
Sintering technology for e-mobility and power electronics
Packages with high-performance semiconductors are key components for the energy transition and e-mobility. For this reason, Tresky Automation have been working on the sintering process…
What is Ribbon Bonding?
Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are precisely aligned and bonded…
Hirox microscope at the 20th international ICOM-CC conference
We are pleased to announce that Hirox will be participating and will have a stand with their microscope at the 20th international ICOM-CC conference. The…
Dynamic TO-Heating Unit
Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities. The TO – Heating unit…