New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG®150-class performance in a smaller-scale, highly flexible format EV Group (EVG), a…
Loadpoint, the home of advanced dicing solutions and services. They are pioneers in providing innovative dicing solutions that meet the most demanding requirements of the…
Meet the new E-LINE 100, well-established and unique multifunctional nanoengineering EBL Raith system now with more functionalities and better performance! Key Features: •True multifunctionality…
For demanding photonic and optoelectronic applications, Tresky provides high precision active alignment systems that ensure optimal optical performance and repeatability. Active alignment of optical…
We are proud to announce that F&S BONDTEC has been awarded 2nd Place at the prestigious Productronica Innovation Award 2025 – right in the year…
The latest innovation in 3D Digital Microscopy. The HRX-02 is the result of over 40 years of optical manufacturing from Hirox. Zoom from 0.1x…
Raith company launched ATHOS, new laser lithography product series engineered specifically for holographic origination and optical security. ATHOS is the ultimate laser lithography…
For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical…
The Bondtec team, a leading manufacturer of wire bonders and specialist in battery bonding, repaired AGH Racing high-voltage battery packs, and thanks to this, the…
With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing….
F&S Bondtec Semiconductor at The Battery Show Europe 2025 in Stuttgart, June 3-5, 2025 F&S BONDTEC, leading producer of wire bonders and pull/shear testers,…
RAITH is excited to present the first all in one configurable SEM system for metrology, defect inspection and SEM review with a focus on gauge…
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This…
Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces EV Group (EVG), a leading provider of…
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of…
IONMASTER is a powerful ion microscope for 3D imaging and SIMS nanoanalytics. This groundbreaking instrument is designed to redefine the boundaries of advanced material characterization….
EVGroup (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, invites you to their booth at…
Thank you for visiting the HIROX table at Evertiq Expo in Warsaw! Do you want to take advantage of state-of-the-art visual inspection, 2D, 3D…
Harald Wiesbauer and Anna Duduś from EVGroup will be taking part in the Workshop on the Physics and Technology of Semiconductor Lasers in Sopot and…
Stefan Berger from F&S Bondtec Semiconductor will be together with the 53xxBDA wire bonder at the InterNanoPoland conference in Katowice on October 16-17, 2024….
It’s been 30 incredible years of innovation, growth and success at F&S Bondtec. From humble beginnings to becoming a global leader in the semiconductor industry,…
NEW, 1000N High Force Die Bonder with intigrated compensations frame. Programmable Z-axis and new motorized Theta-axis (spindle rotation). Tresky’s T-5500 adds a High Force…
As the world around us is constantly evolving, so is Raith as a company. Much has happened over the past years, and they want their…
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users and makes it…
PCIM Europe is a leading trade fair for power electronics, intelligent motion, renewable energy and energy management. We warmly invite you to visit Bondtec booth…
PCIM Europe and SMTconnect trade fair in Nuremberg start tomorrow! We invite you to visit the stands: Dr Tresky AG https://www.tresky.com/ 5.326 Die…
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that new developments in heterogeneous…
While wedge-wedge bonding is effective, it has its limitations in applications with finer pitches and certain materials. Moving to ball bonding offers more flexibility and…
In the cooperative project MUSIC, Silicon Austria Labs (SAL) and four industrial partners STMicroelectronics, USound, EV Group i Evatec are developing new competitive solutions for…
This technical paper explores the compelling motivations behind the alternative of pressure-assisted metallic sintering in the realm of power electronics. As the demand for more…
The English company Loadpoint is not only a manufacturer of precise dicing saws, but also offers cutting services. New clean room, featuring 3 state of…
The newest addition to Raith’s portfolio, the PICOMASTER series adds laser lithography capabilities to their already impressive range of solutions. In a fascinating webinar hosted…
Pull testing is a vital quality control technique in wire bonding. What is Pull Testing in Wire Bonding? Pull testing is a testing method that…
At the end of November EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, completed…
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award for ‘Best Innovation in Holographic Technology’! Each year since 1994, the International Hologram Manufacturers Association…
The Productronica and Semicon fairs in Munich have started today. We invite you to visit the booths of the following companies: ATV Technologies Hall…
Thank you for visiting our stand at Evertiq Expo. It was a pleasure to meet you and demonstrate the HIROX microscope and its unique features!…
Packages with high-performance semiconductors are key components for the energy transition and e-mobility. For this reason, Tresky Automation have been working on the sintering process…
Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are precisely aligned and bonded…
We are pleased to announce that Hirox will be participating and will have a stand with their microscope at the 20th international ICOM-CC conference. The…
Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities. The TO – Heating unit…
Ever thought you’d reached the limits of what is possible with your nanofabrication system? Working with a multi-ion-species FIB-SEM might be the answer. FIB Product…
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE…
Central component of Bondtec machines is the bond head or test head. Coupled with their innovative software – Bondstar – they are the heart of…
Hirox, the manufacturer of microscope systems, has a booth at the Control Show Hall 9 – Stand 9323 Nano Point Scanner – White Light…
Dr Tresky, manufacturer of manual and semi-automatic die bonders, has a stand at the international SMTconnect exhibition in the areas of development, production, services and…
Tresky Automation, one of the world’s leading manufacturers of die bonders, has its stand at the international exhibition PCIM Europe for Power Electronics, Intelligent Motion,…
The VELION FIB-SEM system enables FIB imaging to be performed with various ion species including Lithium. Due to its unique setup with a vertically mounted…
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in…
