Dicing Services
The English company Loadpoint is not only a manufacturer of precise dicing saws, but also offers cutting services. New clean room, featuring 3 state of…
Category: News
Mastering Nanostructures – LBL (Laser Beam Lithographjy) webinar available on demand
The newest addition to Raith’s portfolio, the PICOMASTER series adds laser lithography capabilities to their already impressive range of solutions. In a fascinating webinar hosted…
Discover the World of Pull Testing of Wire Bonds!
Pull testing is a vital quality control technique in wire bonding. What is Pull Testing in Wire Bonding? Pull testing is a testing method that…
EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity
At the end of November EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, completed…
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award for ‘Best Innovation in Holographic Technology’! Each year since 1994, the International Hologram Manufacturers Association…
A good opportunity to meet companies at the Productronica and Semicon and discuss your needs and expectations.
The Productronica and Semicon fairs in Munich have started today. We invite you to visit the booths of the following companies: ATV Technologies Hall…
Hirox microscope at Evertiq Expo in Warsaw
Thank you for visiting our stand at Evertiq Expo. It was a pleasure to meet you and demonstrate the HIROX microscope and its unique features!…
Sintering technology for e-mobility and power electronics
Packages with high-performance semiconductors are key components for the energy transition and e-mobility. For this reason, Tresky Automation have been working on the sintering process…
What is Ribbon Bonding?
Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are precisely aligned and bonded…
Hirox microscope at the 20th international ICOM-CC conference
We are pleased to announce that Hirox will be participating and will have a stand with their microscope at the 20th international ICOM-CC conference. The…
Dynamic TO-Heating Unit
Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities. The TO – Heating unit…
Unlimited FIB possibilities – Webinar series available on demand now!
Ever thought you’d reached the limits of what is possible with your nanofabrication system? Working with a multi-ion-species FIB-SEM might be the answer. FIB Product…
EV Group Scores Big With Eleventh Consecutive Triple Crown Win in TechInsights 2023 Customer Satisfaction Survey
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE…
The bonding head or test head together with the innovative Bondstar software are the heart of Bondtec devices.
Central component of Bondtec machines is the bond head or test head. Coupled with their innovative software – Bondstar – they are the heart of…
Hirox Europe at the Control Show in Stuttgart, May 9-12, 2023
Hirox, the manufacturer of microscope systems, has a booth at the Control Show Hall 9 – Stand 9323 Nano Point Scanner – White Light…
Dr. Tresky at SMTconnect in Nuremberg, May 9-11, 2023
Dr Tresky, manufacturer of manual and semi-automatic die bonders, has a stand at the international SMTconnect exhibition in the areas of development, production, services and…
Tresky Automation at PCIM Europe in Nuremberg May 9-11, 2023
Tresky Automation, one of the world’s leading manufacturers of die bonders, has its stand at the international exhibition PCIM Europe for Power Electronics, Intelligent Motion,…
Combining an ion microscope with precise, easy, and efficient milling
The VELION FIB-SEM system enables FIB imaging to be performed with various ion species including Lithium. Due to its unique setup with a vertically mounted…
Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in…
Follow HIROX on YouTube!
Discover the world of 3D Digital Microscopy in Videos For the latest presentations, TV shows and sample videos, we invite you to a journey in…
Digital ultrasonic generator D-USGX
Newly developed by Bondtec digital ultrasonic generator D-USG X is perfectly suited to work with all common transducers for bonding wires and ribbons of all…
4PICO Litho is now Raith Laser Systems B.V.
Following the acquisition of the 4PICO Group by Raith in June 2021, a major step of the integration is now complete: 4PICO has now been…
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
Redesigned 200-mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while maintaining industry-leading capabilities of previous-generation platform The redesigned…
Tresky offers die bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often, the…
Raith User Meeting – the first Raith Expert Workshop and Skill Day
Dirk Brueggemann and whole team of Raith invites for the first Raith Expert Workshop and Skill Day in Dortmund on December 7th and 8th! Two…
Would you like to see your samples using the best microscope system? Visit Hirox at the Evertiq Expo.
We are happy to invite you to the HIROX table No. 8 during the Evertiq Expo in Warsaw on October 27th! Would you like to…
F&S Bondtec Semiconductor at MRW2022 in Gdańsk and 9th Workshop on Physics and Technology of Semiconductor Lasers 2022 in Kraków
The Austrian company F&S Bondtec Semiconductor, a producer of wire bonders, had their tabletop during the 10th Microwave and Radar Week MRW-2022 conference in Gdańsk,…
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-On-A-Chip
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates important step forward in achieving process maturity EV Group (EVG), a leading provider of…
DIE Stacking
DIE Stacking is an assembly process in which multiple chips are stacked on top of each other on a substrate. In this case, a pin…
Raith is now ISO-certified
After thorough preparation and a packed week of audits, they are happy to announce that they are now certified under ISO 9001:2015. The certificate now…
What is automatic pattern recognition for bonders?
Today we ask ourselves: “What is automatic pattern recognition for bonders?“ Each of our automatic wire bonder can be equipped with an automatic pattern recognition…
EBL at the push of a button with new VOYAGER features
The implementation of some very powerful new features have led to more automation, efficiency and ergonomics for the well-known and field-approved electron beam lithography system…
New website of Hybrid Laser Tech Limited is now live!
Specialists in laser cutting, marking and engraving Founded in 1987, Hybrid Laser Tech Limited (part of the Shearline Group) has been manufacturing and supplying precision…
Hirox Europe during EPHJ ? the World of High Precision
Hirox 3D digital microscope inspired film maker Dayton Taylor to make this cool video and interview of Emilien Leonhardt during EPHJ ? the World of…
Tresky Automation – T-6000-L/G
Based on the proven T-6000-L series, the Die Bonder T- 6000-L/G has been further enhanced Improvements include a stable granite gantry and a high-precision control…
EV Group Earns Outstanding Tenth Consecutive Triple Crown Win in TechInsights 2022 Customer Satisfaction Survey
EVG achieves 5 Star rating for first time in both ?10 BEST? and ?THE BEST? suppliers segments; continues winning streak with 20th consecutive year listed…
Hirox digital 3D microscope at the ITM 2022 trade fair in Poznań
How the Hirox technology makes easier to understand or discover the characteristics of the tested samples. The last few years have been busy for us…
BTU, F&S Bondtec Semiconductor, Haiku Tech Europe B.V., Tresky GmbH at SMTconnect 2022 in Nuremberg on days 10-12.05.2022.
SMTconnect trade fair in Nuremberg starts soon! We invite you to visit the stands: BTU International Inc. 4A.411 BTU International is supplier of advanced thermal…
Ideas to save time and effort. Accessories for your bonder and tester from F&S BONDTEC
Having the right accessories for your wire bonder is an important part of achieving the best wire bonding quality. It also makes your daily work…
HIROX SERVICES
In addition to providing advanced microscope equipment, Hirox offers the following services: subcontract inspection, measurement and reporting, video production for documentaries, calibration, maintenance, advanced training,…
Hirox supplies a full line of high resolution 3D measurement systems
Hirox supplies a full line of high resolution 3D measurement systems: NPS- Confocal 3D white light system The NPS is a white light confocal point…
The recycling of used battery modules
The recycling of used battery modules is of great economic interest and is also promoted and required at the political level by the EU. It…
EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status ST. FLORIAN, Austria, January 25, 2022?EV Group (EVG), a leading supplier…
EVG?7300: NEW MULTI-FUNCTIONAL MICRO- / NANOIMPRINT AND LENS STACKING SOLUTION FROM EV GROUP FOR OPTICAL DEVICE MANUFACTURING
January 18, 2022 ? EV Group today introduced the EVG?7300 automated SmartNIL? nanoimprint and wafer-level optics system, the company?s most advanced solution to combine multiple…
Wire bonding – one technology – countless possibilities.
In all the years in the bonding industry, we have received all sorts of requests for especially demanding applications. We are always happy to implement…
Learn how to achieve versatile results faster, cleaner, cheaper and more reliable than ever before – New Raith nanoFIB Whitepaper available!
Raith?s nanoFIB column is the heart of the FIB-centric FIB-SEM system VELION. The proprietary source and column technology advances FIB to the performance level of…
ATV Technologie, BTU, F&S Bondtec Semiconductor, Haiku Tech Europe B.V., Tresky GmbH at Productronica and EVG at Semicon Europe in Munich.
Productronica and Semicon Europe trade fairs in Munich start today! We invite you to visit the stands: ATV Technologie GmbH A4.279 Manufacturer of vacuum soldering…
Nano ? Micro ? Lithography Symposium – Joint Online Symposium – November 4th, 2021
Dear Sirs, you are cordially invited to the Nano-Micro-Lithography Symposium! As always, the Symposium features technical experts as well as customers from Nanoscribe, micro resist…