VECTOR – Raith’s new solution that takes SEM measurements to the next level
RAITH is excited to present the first all in one configurable SEM system for metrology, defect inspection and SEM review with a focus on gauge…
Author: Katarzyna Piekarska
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This…
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System
Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces EV Group (EVG), a leading provider of…
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of…
New, revolutionary IONMASTER (FIB SIMS tool) from Raith provides incredible capabilities in elemental analysis.
IONMASTER is a powerful ion microscope for 3D imaging and SIMS nanoanalytics. This groundbreaking instrument is designed to redefine the boundaries of advanced material characterization….
EVGroup at Semicon Europa in Munich
EVGroup (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, invites you to their booth at…
HIROX microscope once again at Evertiq Expo in Warsaw
Thank you for visiting the HIROX table at Evertiq Expo in Warsaw! Do you want to take advantage of state-of-the-art visual inspection, 2D, 3D…
EVGroup at Laser Workshop in Sopot and InterNanoPoland in Katowice
Harald Wiesbauer and Anna Duduś from EVGroup will be taking part in the Workshop on the Physics and Technology of Semiconductor Lasers in Sopot and…
Bondtec at InterNanoPoland in Katowice
Stefan Berger from F&S Bondtec Semiconductor will be together with the 53xxBDA wire bonder at the InterNanoPoland conference in Katowice on October 16-17, 2024….
F&S Bondtec Semiconductor celebrates 30th Anniversary!
It’s been 30 incredible years of innovation, growth and success at F&S Bondtec. From humble beginnings to becoming a global leader in the semiconductor industry,…
New Tresky T-5500 High Force Die Bonder & Component Placer
NEW, 1000N High Force Die Bonder with intigrated compensations frame. Programmable Z-axis and new motorized Theta-axis (spindle rotation). Tresky’s T-5500 adds a High Force…
New dimensions – new corporate identity of Raith
As the world around us is constantly evolving, so is Raith as a company. Much has happened over the past years, and they want their…
Manual mode for maximum control and flexibility with Tresky DIE bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users and makes it…
F&S BONDTEC will participate in PCIM Europe for the first time!
PCIM Europe is a leading trade fair for power electronics, intelligent motion, renewable energy and energy management. We warmly invite you to visit Bondtec booth…
Dr Tresky, F&S Bondtec Semiconductor, Tresky Automation GmbH at PCIM Europe 2024 in Nuremberg on days 11-13.06.2024.
PCIM Europe and SMTconnect trade fair in Nuremberg start tomorrow! We invite you to visit the stands: Dr Tresky AG https://www.tresky.com/ 5.326 Die…
EV Group (EVG) Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2024 in Denver.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that new developments in heterogeneous…
The transition from wedge-wedge wire bonding to ball bonding: A technical overview.
While wedge-wedge bonding is effective, it has its limitations in applications with finer pitches and certain materials. Moving to ball bonding offers more flexibility and…
NEW COOPERATIVE PROJECT MUSIC: COMPETITIVE SOLUTIONS FOR MICROACOUSTIC DEVICES
In the cooperative project MUSIC, Silicon Austria Labs (SAL) and four industrial partners STMicroelectronics, USound, EV Group i Evatec are developing new competitive solutions for…
Tresky Automation new white paper regarding pressure-assisted metallic sintering in power electronics is now available for download on their webpage.
This technical paper explores the compelling motivations behind the alternative of pressure-assisted metallic sintering in the realm of power electronics. As the demand for more…
Dicing Services
The English company Loadpoint is not only a manufacturer of precise dicing saws, but also offers cutting services. New clean room, featuring 3 state of…
Mastering Nanostructures – LBL (Laser Beam Lithographjy) webinar available on demand
The newest addition to Raith’s portfolio, the PICOMASTER series adds laser lithography capabilities to their already impressive range of solutions. In a fascinating webinar hosted…
Discover the World of Pull Testing of Wire Bonds!
Pull testing is a vital quality control technique in wire bonding. What is Pull Testing in Wire Bonding? Pull testing is a testing method that…
EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity
At the end of November EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, completed…
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award
PICOMASTER wins the prestigious 2023 International Hologram Manufacturers Association award for ‘Best Innovation in Holographic Technology’! Each year since 1994, the International Hologram Manufacturers Association…
A good opportunity to meet companies at the Productronica and Semicon and discuss your needs and expectations.
The Productronica and Semicon fairs in Munich have started today. We invite you to visit the booths of the following companies: ATV Technologies Hall…
Hirox microscope at Evertiq Expo in Warsaw
Thank you for visiting our stand at Evertiq Expo. It was a pleasure to meet you and demonstrate the HIROX microscope and its unique features!…
Sintering technology for e-mobility and power electronics
Packages with high-performance semiconductors are key components for the energy transition and e-mobility. For this reason, Tresky Automation have been working on the sintering process…
What is Ribbon Bonding?
Instead of a normal wire, it is also possible to bond ribbons. These ribbons, typically made of gold or aluminum, are precisely aligned and bonded…
Hirox microscope at the 20th international ICOM-CC conference
We are pleased to announce that Hirox will be participating and will have a stand with their microscope at the 20th international ICOM-CC conference. The…
Dynamic TO-Heating Unit
Seeing increased demands on the market Tresky offers now the second generation of the dynamic TO-Heating Unit with excellent qualities. The TO – Heating unit…
Unlimited FIB possibilities – Webinar series available on demand now!
Ever thought you’d reached the limits of what is possible with your nanofabrication system? Working with a multi-ion-species FIB-SEM might be the answer. FIB Product…
EV Group Scores Big With Eleventh Consecutive Triple Crown Win in TechInsights 2023 Customer Satisfaction Survey
EVG achieves its highest rankings ever with 5 Star ratings across all applicable award categories; continues winning streak with 21st consecutive year listed among “THE…
The bonding head or test head together with the innovative Bondstar software are the heart of Bondtec devices.
Central component of Bondtec machines is the bond head or test head. Coupled with their innovative software – Bondstar – they are the heart of…
Hirox Europe at the Control Show in Stuttgart, May 9-12, 2023
Hirox, the manufacturer of microscope systems, has a booth at the Control Show Hall 9 – Stand 9323 Nano Point Scanner – White Light…
Dr. Tresky at SMTconnect in Nuremberg, May 9-11, 2023
Dr Tresky, manufacturer of manual and semi-automatic die bonders, has a stand at the international SMTconnect exhibition in the areas of development, production, services and…
Tresky Automation at PCIM Europe in Nuremberg May 9-11, 2023
Tresky Automation, one of the world’s leading manufacturers of die bonders, has its stand at the international exhibition PCIM Europe for Power Electronics, Intelligent Motion,…
Combining an ion microscope with precise, easy, and efficient milling
The VELION FIB-SEM system enables FIB imaging to be performed with various ion species including Lithium. Due to its unique setup with a vertically mounted…
Rework of LED dies using debonding solution from Tresky Automation
In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in…
Follow HIROX on YouTube!
Discover the world of 3D Digital Microscopy in Videos For the latest presentations, TV shows and sample videos, we invite you to a journey in…
Digital ultrasonic generator D-USGX
Newly developed by Bondtec digital ultrasonic generator D-USG X is perfectly suited to work with all common transducers for bonding wires and ribbons of all…
4PICO Litho is now Raith Laser Systems B.V.
Following the acquisition of the 4PICO Group by Raith in June 2021, a major step of the integration is now complete: 4PICO has now been…
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
Redesigned 200-mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while maintaining industry-leading capabilities of previous-generation platform The redesigned…
Tresky offers die bonding prototyping and small series production
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often, the…
Raith User Meeting – the first Raith Expert Workshop and Skill Day
Dirk Brueggemann and whole team of Raith invites for the first Raith Expert Workshop and Skill Day in Dortmund on December 7th and 8th! Two…
Would you like to see your samples using the best microscope system? Visit Hirox at the Evertiq Expo.
We are happy to invite you to the HIROX table No. 8 during the Evertiq Expo in Warsaw on October 27th! Would you like to…
F&S Bondtec Semiconductor at MRW2022 in Gdańsk and 9th Workshop on Physics and Technology of Semiconductor Lasers 2022 in Kraków
The Austrian company F&S Bondtec Semiconductor, a producer of wire bonders, had their tabletop during the 10th Microwave and Radar Week MRW-2022 conference in Gdańsk,…
EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-On-A-Chip
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates important step forward in achieving process maturity EV Group (EVG), a leading provider of…
DIE Stacking
DIE Stacking is an assembly process in which multiple chips are stacked on top of each other on a substrate. In this case, a pin…